K’a ta kunmabɔnafolo hakɛ la ka se aerospace grade ma, danfara jumɛn bɛ chips ni ɲɔgɔn cɛ?

The grade division of chips is actually the division of the harshness of the chip application environment. Our common chips are usually divided into four categories, civilian grade (consumer grade), industrial grade, automotive grade and military grade (aerospace grade). At present, the highest specification chip we can access is the car specification chip. Compared with consumer-grade chips, automotive-grade chips can withstand more extreme temperatures and usage Sigidaw.

Ikomi sɔrɔdasi-kalanso ni mobili-kalan-minɛnw fanga ka bon kosɛbɛ, yala a tɛna se ka kɛ sababu ye ka chips bɛɛ kɛ ka chips caman ka sariyaw dafa wa?

Chip grading is not that simple. It actually involves the entire process of circuit design, manufacturing process, and final packaging and testing of chips. High-standard chips may not be suitable for other levels of environments. First of all, chips with higher specifications often mean higher prices, and paying for impossible application scenarios will reduce the cost-effectiveness of chips. Moreover, it is not that the higher the chip level, the faster the processing Teliya. Tuma dɔw la, puce bɛna baara kɛcogo yɔrɔ dɔ saraka walasa a kana bin baarakɛcogo kɛrɛnkɛrɛnnenw na.

N’an b’a fɔ cogo nɔgɔman na, redundancy design ye ka dɔ fara puce ka dannaya kan ka kɛɲɛ ni nafolodonni caya ye.

Circuit redundants (circuit redundant) sɔrɔli chip (puce) kɔnɔ, o tɛ tiɲɛni ye, bawo chip (puce) ka kan ka labɛn ka dafa ni baara dɔnbaliw bɛ ka dɔgɔya walasa ka dɔ bɔ downtime (dabila) seko la cogoya kɛrɛnkɛrɛnnenw na. puce (puce) dilancogo dɔnbagaw bɛ circuit redundant (circuit) ɲɛfɔ: "An bɛ se ka systeme (sistema) labɛn walasa ka buffer (tampon) caman kɛ processeur (porosesɛri) ni memory (hakilijagabɔ) cɛ walasa ka capeur (hakilila) caman kɛ ani o tuma na, o tuma na maximum transaction (hakilila) bɛ se ka kɛ fɛn ye min bɛ se ka kɛ fɛn ye min bɛ se ka kɛ fɛn ye min bɛ se ka kɛ fɛn ye min bɛ se ka kɛ fɛn ye min bɛ se ka kɛ fɛn ye min bɛ se ka kɛ fɛn ye min bɛ se ka kɛ fɛn ye min bɛ se ka kɛ fɛn ye min bɛ se ka kɛ fɛn ye min bɛ se ka kɛ fɛn ye min bɛ se ka kɛ fɛn ye min bɛ se ka kɛ fɛn ye min bɛ se ka kɛ fɛn ye min bɛ se ka kɛ sababu ye ka fɛn caman kɛ fɛn caman na. Issues". caches redundant dɔw bɛ se ka crashes bali ni memory (hakilila) bɛ fa ni baara belebelew bɛ kɛ parallèges (.) ka fara o kan, o nɔ kelen bɛ se ka sɔrɔ fana memory redundancy design.

Tiɲɛ don, ka sɛrɛkiliw dilan minnu tɛ fɛn ye, o tɛ kopi ni paste nɔgɔman ye{0}} misali la, chip izini bɛ se ka dɔ fara baarakɛcogo seko hakɛ kan baarakɛcogo dɔw la, i n’a fɔ hakilijagabɔ ni cakɛda min kofɔlen don sanfɛ, o bɛ se ka kɛ sababu ye ka puce ka se ka tampon waati koɲɛw ɲɛnabɔ ani ka fɛn caman Changer waati bɛnnen na redundancy fana bɛ se ka kɛ ip coture ip core ye, hali n’a tɛ computing teliya teliya ye, a bɛ se ka dannaya bonya kosɛbɛ; Baarakɛbaliya fana bɛ se ka kɛ sababu ye ka baarakɛla bila ka fɛɛrɛ sabatilen ta sanni ka fɛɛrɛ ɲuman ta ni jatebɔ kɛra alɔgɔridi dɔw kan, ka se ka i yɛrɛ tanga tiɲɛni ma min bɛ sɔrɔ jatebɔ filiw fɛ.

Kuma bɛɛ la, redundancy tɛ redundant. injiniyɛriw ye autonome driving siratigɛ la industry kɔnɔ, olu y’a jira ko: "Dacogo fan caman ye sariyaw ye minnu bɛ se ka kɛ thuught ye. U bɛ se ka 30% margin ɲini walasa ka waati buffer{. di o ma, nin bɛ se ka kɛ cogo min na, o bɛ se ka kɛ cogo min na, o tɛ se ka kɛ cogo min na. Kow."

Sani silikoni monokirisitalini laban ka kɛ chip ye an bolo ka baara kɛ ni min ye, a ka kan ka tɛmɛ dilancogo, fɛn dilanni, pake, sɛgɛsɛgɛli ani jɛgɛnsira wɛrɛw fɛ. pakew kuntilenna jɔnjɔn dɔ ye ka die fragile lakana ka bɔ kɛnɛma sigida la.

Aw bɛ aerospace-grade chips ta i n’a fɔ misali. chips consumer-grade ordinaires bɛ se ka lakana bɛrɛ sɔrɔ ni plastiki pakew ye, ka sɔrɔ aerospace-grade chips ka teli ka kɛ pakew kɔnɔ seramiki walima nɛgɛw la, ani pake fana bɛ kɛ ni brass layer ye walasa ka cosmic rays ani high-temprature environments{. kɛ ka kɛɲɛ ni gag ye min bɛ sɔrɔ ka kɛɲɛ ni fiɲɛbɔ waati ye min bɛ sɔrɔ secondaire effects fɛ, a bɛ kɛ ka kɛɲɛ ni gag ye min bɛ se ka kɛ sababu ye ka sekɔndi rase sɔrɔ ka se ka kɛ sababu ye ka fɛn filananw kɛ ka ɲɛ.

Sisan, mobili ɲɛfɔcogo hakɛ ye fɛn ye min bɛ se ka kɛ fɛn ye min bɛ se ka kɛ fɛn ye min bɛ se ka kɛ fɛn ye min bɛ se ka kɛ fɛn ye min bɛ se ka kɛ fɛn ye min bɛ se ka kɛ sababu ye ka a ka baara kɛcogo ɲɛ, a ka baara funteni ka kan ka se degere -40 ma , wa a fana ka kan ka kɛ sanpɛrɛn ye min tɛ se ka suma, ani min bɛ se ka kɛ fɛn ye min bɛ se ka kɛ fɛn ye min bɛ se ka kɛ ni fɛn ye min bɛ se ka kɛ ni fɛn ye min bɛ se ka kɛ ni a bɛ se ka kɛ fɛn ye min bɛ se ka kɛ ni fɛn ye min bɛ se ka kɛ fɛn ye min bɛ se ka kɛ fɛn ye min bɛ se ka kɛ fɛn ye min bɛ se ka kɛ ni fɛn ye min bɛ se ka kɛ fɛn ye min bɛ se ka kɛ fɛn ye min bɛ se ka kɛ fɛn ye min bɛ se ka kɛ fɛn ye min bɛ se ka kɛ fɛn ye min bɛ se ka kɛ ni fɛn ye min bɛ se ka kɛ fɛn ye min bɛ se ka kɛ ni fɛn ye min bɛ se ka kɛ fɛn ye min bɛ se ka kɛ ni fɛn ye min bɛ se ka kɛ fɛn ye min bɛ se ka kɛ ni fɛn ye min bɛ se ka kɛ fɛn ye min bɛ se ka kɛ ni fɛn ye min bɛ se ka kɛ fɛn ye min bɛ se ka kɛ ni fɛn ye min tɛ Pucew bɛ pake SIP kɔnɔ. module minnu bɛ jatebɔ sabatili caman wajibiya, olu fanba bɛ don ɲɔgɔn na pakew lakanani kama. waati kelen na, modulu suguya caman cɛ kumaɲɔgɔnya janya bɛ dɔgɔya, wa a bɛ se ka kɛ ko a bɛ se ka nɔ bila kunnafonidi waati la, o bɛ dɔgɔya.

Tiɲɛ na, a kɛra izini-kalanso ye, mobili-kalanso walima sɔrɔdasi-yɔrɔ-la-sɛnɛ-minɛn ye, labɛnni caman kɛlen kɔfɛ a daminɛ na, sugandili ni sɛgɛsɛgɛli gɛlɛnw ka kan ka kɛ san kelen-kelen bɛɛ laban na. pucew tɛ dilan puce dilanbagaw fɛ, wa u yɛrɛ bɛ da u yɛrɛ la, wa u ka kan ka latigɛ ka kɛɲɛ ni sɔnni kɔfɛ so kɔnɔ baarakɛda minnu bɛ tali kɛ o la{5}}.

Sisan, pucew tilalen don ɲɔgɔn na ka kɛ san naani ye, consumer grade, industrial grade, automotive grade ani militration (aerospace) grade. puce minnu kalasi ni u ka fɛn dilannenw tɛ kelen ye, olu ka ɲininiw tɛ kelen ye k’a ta dilancogo la ka se pakew ni sɛgɛsɛgɛli taabolo ma, ani baarakɛcogo fana bɛ danfara bɔ kosɛbɛ. caman na, ni chip handancy design ka bon kosɛbɛ, o ye sɛgɛsɛgɛli ye min ka ca ni o ye, ani ka tɛmɛ o kan, ani ka tɛmɛ o kan, o ye fɛn ye min bɛ tɛmɛ o kan, ani ka tɛmɛ o kan.