Puce pake otomatiki

Dec 12, 2025

Aw bɛ cikan bila .

 

Chip Bonding / Die Bonder

Puce bonding ye fɛɛrɛ ye min ka gɛlɛn kosɛbɛ RFID inlay dilanni na. Ni paramɛtɛrɛ minnu bɛ bonding station la, olu bɛ wuli hali dɔɔnin, tɛmɛsira hakɛ min bɛ RF sɛgɛsɛgɛli la, o bɛna o jira o yɔrɔnin bɛɛ.

 

Ni wafer sera, chips bɛ to kase bulu kan. Minɛn in bɛ ni ejector pin ye min bɛ gɛrɛ ka bɔ duguma ka sɔrɔ vacuum nozzle bɛ pick ka bɔ sanfɛ, ka chips bɔ kelen kelen. Ejector pin diameter ka dɔgɔn dɔɔni ka tɛmɛ chip kan, a bɛ milimɛtɛrɛ tilayɔrɔba dɔ lamini, wa a ka kan ka gɛrɛ chip cɛmancɛ la yɛrɛ. Ni a ye a gɛrɛntɛ ka bɔ-cɛmancɛ la, puce bɛ kɔrɔta san fɛ ani nozzle tɛ se k’a minɛ. Kase bulu yɛrɛ ka nɔrɔli hakɛ tɛ kelen ye. UV furakɛli jan kɔrɔ ye nɔrɔli barika dɔgɔyali ye min bɛ picking nɔgɔya, nka chips bɛ se ka wuli ka taa ni u ye. Tuma o tuma n’an bɛ wuli ka taa kase bulu kulu kura la, an ka kan ka fɛɛrɛtigi dɔ sɔrɔ walasa ka ejector janya n’a bɔli teliya sɛgɛsɛgɛ. Teliya kojugu ani puce bɛ pan ka taa, a bɛ teliya kojugu ani a bɛ nɔ bila cycle waati la.

 

Puce bɛ bɔ ka ɲɛsin san fɛ, o la a ka kan ka wuli walasa ka bugunw ɲɛsin duguma walasa ka siri. An ka minɛnw bɛ baara kɛ ni flip station fɛɛrɛ ye. Nose bɛ puce bila flip station kan, station bɛ wuli degere 180, o kɔfɛ nozzle wɛrɛ b’a ta ka bɔ fan dɔ fɛ. Izini dɔw bɛ baara kɛ ni fiɲɛbɔlanw ye minnu bɛ u yɛrɛ wuli, o bɛ bololabaara kelen kisi, nka o bɛ degun sabatilenba de wajibiya. Tansiyɔn jiginni fɛn o fɛn ani puce bɛ jigin. Fɛn wɛrɛ bɛ nin flipping step in na. Puce (puce) jɔyɔrɔfalen ka kan ka mara. Flipping kɔfɛ, deviation min bɛ X, Y ani θ la, o tɛ se ka bonya kojugu, n’o tɛ yeli musaka hakɛ tɛna se kɔfɛ.
Antɛni dugumalan ye PET roll stock ye, a ka c’a la, a janya ye mikron 50 walima 75 ye, ni aluminiyɔmu antɛni misaliw sɛbɛnnen don a kan kaban, mɛtɛrɛ ba caman roll kelen kɔnɔ. PET bɛ bɔ lafiya fan fɛ, ka tɛmɛ tension rollers caman fɛ, ka jɔ bonding station la. Puce kelen-kelen bɛɛ bilalen kɔfɛ, web bɛ taa ɲɛ ni fɔlikan kelen ye, ka jɔ, ka siri kokura. A ka c’a la, jɔrɔnanko bɛ Kɔrɔsi Newton damadɔ kɔnɔ. A bɛ lafiya kojugu ani web bɛ sɛgɛn ka kɛ sababu ye ka jɔyɔrɔ fili, ka siri kojugu ani PET bɛ sɔgɔsɔgɔ ka antɛni misali hakɛw tiɲɛ. An ye ko dɔ kɛ, n’o ye ko tension sensor min bɛ kɔsegin fan fɛ, o wulila, antɛni kurulen bɛɛ tiɲɛna, sɛgɛsɛgɛli ma ɲɛ pewu, wa kiliyan y’a miiri ko fɛn dɔ bɛ an ka puwɛntiw la.

 

Nɛgɛw dicogo bɛ kɛ sani u ka siri. ACA kɔrɔ ye ko Anisotrope Conductive Adhesive. O ye epoxy resin basigilen ye min kɔnɔna na, fɛnw bɛ taa ni fɛnw ye minnu bɛ taa ni fɛnw ye. A ka c’a la, fɛn minnu bɛ taa ni fɛnw ye, olu ye plastiki bololanɛgɛw ye minnu dilannen don ni nikɛri ye o kɔfɛ sanu, u cɛmancɛ bɛ se mikron 3 fo 5 ma, minnu jɛnsɛnnen don nɛgɛdaga kɔnɔ. Sani a ka kɛnɛya, a fɛnɲɛnamafagalanw bɛ jɛnsɛn. Degun waati u bɛ sɔgɔsɔgɔ fla la puce bumps ni antenne pads cɛ, o bɛ conductivity (conductivity) Dabɔ. Yɔrɔ minnu ma degun, olu bɛ ni fɛnɲɛnamafagalanw jɛnsɛnnenw ye hali bi, wa u bɛ to ka kɛ fɛn ye min tɛ-fɛnw ta. Nin fɛn in sɔngɔ ka gɛlɛn, kilo kelen na, a bɛ kɛ yuan ba caman ye, wa fɛn minnu bɛ na ni u ye jamana wɛrɛw la i n’a fɔ Hitachi ani Sony, olu musaka ka ca ni o ye yɛrɛ. Dilan hakɛ ka kan ka kɔlɔsi tigitigi. An bɛ baara kɛ ni pikirijikɛlan ye, ka miligaramu tilayɔrɔba dɔ bila a kɔnɔ o waati kelen-kelen bɛɛ la. Dɔgɔya kojugu ani contact resistance bɛ wuli ka kalan hakɛ dɔgɔya, ka caya kojugu ani a bɛ fa ka traces kɛrɛfɛtaw siri ka kɛ sababu ye ka shorts. An ye masin baarakɛla kura dɔ sɔrɔ an ka izini na min ye fiɲɛ dilancogo tansiyɔn wuli, batch bɛɛ bɔra ani kiliyanw ye ŋunankan fɔ surukuw kan yɔrɔ bɛɛ, o musaka caman kɛra an na musaka la. Izini dɔw bɛ baara kɛ ni stensili sɛbɛnni ye nɔrɔli kama, teliya la nka i ka kan ka stensili caman Changer ni i bɛ fɛnw Changer, o tɛ sɔrɔko ye batch misɛnninw na minnu bɛ ni SKU caman ye.

RFID antenna substrate roll
 
ACA/ACF
Compression step de ka gɛlɛn kosɛbɛ. Bond kun bɛ puce ta ka jigin ka a digi antenne pads kan. Sanfɛla ni duguma kameraw ye puce bump jɔyɔrɔw ni pad jɔyɔrɔw minɛ kaban u danma, porogaramu in bɛ ja dɔnni kɛ walasa ka deviation jate XY siraw ni angle la, o kɔfɛ mechanical arm bɛ compensate. An ka minɛnw bɛ segin-ka-bɔ-yɔrɔ-ko tigitigi lamini ni plus walima minus ye mikron 20 fo 30 ye, o ka ɲi HF puwɛntiw ma bawo puwɛnti hakɛ ka bon ani bump pitch ka bon. UHF pucew ye fɛn ye min bɛ mɔgɔ lafili. Puce dɔw ye 0,4mm square dɔrɔn ye ni bugun fila dɔrɔn ye. Miss by a little ani i tɛ jigin pad kan hali dɔɔnin.
 

 

 

Ni aw ye a digidigi duguma, funteni bɛ nɔrɔli furakɛ. An ka minɛnw bɛ ni funteni bloki ye bond kun na, wa plateforme min bɛ duguma, o fana bɛ se ka sumaya. A ka c’a la an bɛ sanfɛla bila degere 170 lamini na ani duguma ka kɛ degere 150 walima 160 ye, o la funteni bɛ bɔ fan fila bɛɛ la ka taa cɛmancɛ la walasa ka kɛnɛya ka caya hali. Aw bɛ a minɛ fo sekɔndi 10 fo sekɔndi 20 ka kɛɲɛ ni nɔrɔ suguya ye. ACA furakɛli ye epoxy resin ka crosslinking reaction ye a jɔyɔrɔba la. Ni funteni walima waati ma se ani ni crosslinking ma dafa, a bɛna dɛsɛ ni aw bɛ 85℃85% humidity kɔrɔya sɛgɛsɛgɛliw kɛ kɔfɛ. Nka ni funteni ka bon kojugu PET substrat fana tɛ se k’a kunbɛn, a bɛ kurukuru ani ka bɔgɔbɔgɔ. Degun fana nafa ka bon. Dɔgɔya kojugu ani conductive particules tɛ sɔgɔsɔgɔ ka ɲɛ, contact area tɛ se ka kɛ ani resistance ka bon. A caya kojugu ani plating min bɛ fɛnɲɛnamafagalanw sanfɛ, o bɛ kari ka ɲɔgɔn sɔrɔ ka juguya, walima nɔrɔli bɛ sɔgɔ ka bɔ ani fɛnɲɛnamafagalanw tilatilali bɛ kɛ cogo la min tɛ kelen ye. O paramɛtɛrɛ saba ninnu bɛɛ bɛ ɲɔgɔn na. Aw bɛ kelen Changer ani aw ka kan ka tɔw ladilan. Minɛnw bɛ paramɛtiri furakɛcogo tan ni caman mara puce ni adhesive faralen ɲɔgɔn kan cogoya wɛrɛw la, u bɛ doni dɔrɔn de don ni fɛnw bɛ ɲɔgɔn falen.

ACA/ACF

 

 

Puce kelen kɛnɛyalen kɔ web bɛ taa ɲɛ ani antenne nata bɛ don ka taa ɲɛ. Minɛn teliyalenw bɛ se ka puwɛnti fila walima saba siri segin kɔnɔ. Mühlbauer ka fɛnw donna jamana kɔnɔ, olu bɛ teliya ka tɛmɛ o kan yɛrɛ, nka an ka minɛn kɔrɔ minnu bɛ izini na, olu bɛ kelen ɲɔgɔn dɔrɔn de kɛ segin kɔnɔ. Layini dɔ sɛgɛsɛgɛli bɛ miliyɔn caman musaka bɔ wa patɔrɔn tɛna sɔn o ma. Rewind fan fana bɛ ni tension control ye. A tɛ se ka puwɛntiw sɔgɔ ka bɔ, nka a tɛ se ka lajɔ kojugu walima ka wuli ka fiɲɛ bila ka ɲagami.

 

Kɔrɔbɔli kama an b’a Kɛ ‘kɔnɔna na. Bonding kɔfɛ dɔrɔn a bɛ tɛmɛ RF kalanbaga dɔ fɛ. Unit minnu tɛ kalan, olu bɛ inkjet taamasiyɛn sɔrɔ, o kɔfɛ u bɛ ban slitting waati. Kɔrɔbɔli bɛ kɛ ni puce jaabi ye, ni EPC bɛ se ka kalan ani ka sɛbɛn cogo bɛnnen na, ani ni sensitivity bɛ se. Izini dɔw bɛ sɛgɛsɛgɛli kɛ ɛntɛrinɛti kɔkan, ka rollo bɛɛ ban fɔlɔ ka sɔrɔ k’a boli sɛgɛsɛgɛli masin fɛ, o bɛ baarakɛlaw caman de wajibiya nka minɛnw musaka ka dɔgɔ. I ka kan ka 99% tɛmɛsira gosi walasa ka tɔnɔ sɔrɔ. O jukɔrɔ i tɛ se ka hali baarakɛlaw ni fɛnw dafa, i kana fɔ kiliyanw ka ɲininkaliw ni baara seginni musakaw ye.

 

Aw ye ɲininkali ci .